【2018-0396】三维打印复合材料热残余解析解

科技工作者之家 2018-09-03

《复合材料学报》优先在线发表论文。


  要:三维打印纤维增强聚合物基复合材料因层间材料失配和打印过程中梯度降温而产生热残余现象,影响工件成形质量。取代简单的同步降温假设,提出了符合实际制备工艺的梯度降温概念,据此建立了三维打印正交铺层复合材料板和梁的热残余变形和应力的解析解。为反映三维打印过程中随时序动态变化的制备和降温过程,考虑每层制备轮次的降温梯度并进行热残余分析,最后合成得到热残余变形和应力。讨论了四种梯度降温模式,覆盖了所有可能的三维打印工艺。算例验证了本文解析解的精度和可靠性,显示了同步降温假设会产生显著的误差,表明热残余水平与降温梯度成正比,讨论了铺层方式对热残余的影响。为优化三维打印复合材料的结构设计和制备工艺、降低热残余水平提供了可靠的分析方法。


关键词:残余应力;三维打印;纤维;复合材料;梯度降温


Abstract: Thermal residual phenomena occurred in fiber composite laminates by 3D printing due to the material mismatch among layers and the gradient cooling during printing, and affected the forming quality. Instead of the simple assumption of synchronous cooling, the concept of gradient cooling was introduced to characterize real manufacturing processes. The analytical solutions of thermal residual deformations and stresses of cross-ply composite plates and beams were established. To characterize time-dependent forming and cooling processes during 3D printing, a through-thickness cooling gradient was considered in each layer forming turn. The thermal residual responses in each turn were deduced. The total thermal residual deformations and stresses were obtained in an accumulative way. Four gradient cooling models were summarized to cover various 3D printing techniques. The accuracy and reliability of the present solutions are proved in the numerical examples. It is illustrated that the assumption of synchronous cooling would lead to big errors. Thermal residual level is proportional to the cooling gradient. The effects of ply-up patterns on thermal residual responses are discussed. This work provides reliable methods to optimize structures and techniques and decrease thermal residual level in 3D printing.


Keywords: residual stress; 3D printing; fibres; composite; gradient cooling


作者:舒小平等,淮海工学院 机械工程学院,江苏连云港

通讯作者:舒小平,淮海工学院 机械工程学院,江苏连云港

全文详见中国知网学术期刊优先数字出版。


来源:CSCM_OFFICE 中国复合材料学会

原文链接:http://mp.weixin.qq.com/s?__biz=MjM5MTA2NTk1Nw==&mid=2654407438&idx=2&sn=9e2a4112afc02fa41b9d80c4b86631d4&scene=0#wechat_redirect

版权声明:除非特别注明,本站所载内容来源于互联网、微信公众号等公开渠道,不代表本站观点,仅供参考、交流、公益传播之目的。转载的稿件版权归原作者或机构所有,如有侵权,请联系删除。

电话:(010)86409582

邮箱:kejie@scimall.org.cn

微软 打印 三维 梯度 应力 残余 降温 铺层 制备 聚合物基复合材料

推荐资讯