电子封装用环氧树脂固化温度与应变的三维有限元模拟

《复合材料学报》优先在线发表论文。

摘  要：环氧树脂因具有许多优异的性能而被广泛用作电子封装材料，然而环氧树脂在固化过程中产生的内应力会对封装产品的性能产生严重影响。针对一种用于电子封装的环氧树脂，通过实验分析了其固化动力学、密度、导热系数、玻璃化转变温度、弹性模量、化学收缩应变和热应变等性能参数，建立了固化过程中的数学模型。通过Abaqus建立三维有限元模型，采用顺序耦合分析方式，分步进行传热分析和应力应变分析，模拟环氧树脂固化过程中的温度场、固化度场和应力应变场。最后采用光纤布拉格光栅（FBG）监测环氧树脂在固化过程中内部的温度和应变变化，并和模拟进行对比，结果表明本文所建立的有限元模型具有较高的可靠性。

关键词：电子封装；环氧树脂；固化过程；有限元分析；光纤布拉格光栅

Abstract:  Epoxy resins are widely used as electronic packaging material with many excellent performances, however, the internal stress of epoxy resins induced in the curing process will bring about unfavorable influence on packaged products. Many experiments were carried out to research performance parameters of an epoxy resin used to electronic packaging, such as curing kinetics, density, thermal conductivity, glass transition temperature, elastic modulus, chemical shrinkage strain, thermal strain, etc. After that, mathematic models of these parameters in the curing process were established. Three-dimensional finite element model was established with Abaqus to simulate the temperature field, curing degree field, stress and strain field of the epoxy resin in the curing process. Sequentially coupled analysis was used to perform heat conduction analysis and stress-strain analysis successively in Abaqus. Finally, a FBG experiment was carried out to monitor the evolution of temperature and strain in the epoxy resin during the curing process. Comparison of the results between experiment and simulation demonstrates that the finite element model established in this paper is of high reliability.

Keywords:  electronic packaging; epoxy resin; curing process; finite element analysis; fiber Bragg grating。

作者：康峻铭，武汉理工大学 材料科学与工程学院，武汉

通讯作者：王继辉，武汉理工大学 材料科学与工程学院，武汉

全文详见中国知网学术期刊优先数字出版。